Waldorf Technik in Chicago

The Thin wall packaging Conference takes place in Chicago, May 23d and 24th.  The conference offers a meeting point for the industry to debate business trends and developments in packaging technology.

Our North America representative, Mike Urquhart, will be one of the speakers. Topic of his presentation on May 23d at 1.40 p.m. is the Barrier Coating: "Advances in plasma 3D barrier coating for thin wall containers". A highly important and interesting topic as we can see in conversations with our customers. Come and join us!


28.04.2017 12:43 Age: 1

Fairs and exhibitions 2018

Interplas Thailand, Bangkok20.-23. Juni Medtec China 2018, Shanghai26.-28. September Fakuma, Fried More...

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